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Ships within 48 hours · Estimated delivery Sep 3 - Sep 8
or afm+ system
Hot embedding press is needed to use this embedding material
A practical way to store and dispense AFM/STM discs
Consumption rate: 0
Membrane Type
Ultra-Flat SiNx Coated Substrates Size:10 x 10mm pieces in a Gel-Pak® box or afm+ systemDESCRIPTION PRODUCT SPECIFICATIONS Ultra Flat SiNx Coated Substrates The Ultra Flat SiNx Substrates consist of ultra flat silicon wafers coated with 200nm of amorphous nonstoichiometric ultra low stress silicon nitride, similar to our silicon nitride grids. The ultra flat SiNx substrates are available in 6" wafer and conveniently diced 5 x 5mm, 5 x 7mm, and 10 x 10mm chips. The 6" wafer is shipped in a 6" wafer carrier; the diced pieces are shipped in
US$ 139.00
US$ 15.00
US$ 20.00
