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An ideal choice for multiple implant cases requiring parallelization
which is advantageous in specific clinical cases and contributes to a faster scanning workflow
Implant-level connection: Secure and reliable fit to the implant interface
it features an M1
five-edged Ø3
BIONIKA DI UF, Titanium base, angled, positioned, type-A Bredent® SKY An ideal choice for multipleBrand characteristics The BIONIKA DI UF implant system is compatible with the DIO UF platform and features an advanced conical connection (Conical Connection) combined with a hexagonal fit, ensuring micromovement free load transfer and exceptional stability. The 22 cone angle directs forces deep into the implant body, reducing cortical bone stress and promoting long term osseointegration. The spirally micro grooved, self locking, and self compressing
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